Thermal stability of MoNbTaTiW, MoNbTaVW and CrMoNbTaW thin films deposited by high power impulse magnetron sputtering

Georg Gruber, Alice Lassnig, Stanislav Žák, Christoph Gammer, Megan Cordill, Robert Franz

Publikation: Beitrag in FachzeitschriftArtikelForschungBegutachtung

Abstract

With the envisioned use as high-temperature materials, the thermal stability of three high entropy alloy thin films, based on the system MoNbTaW with additional Cr, Ti or V, was studied. All films were deposited by high power impulse magnetron sputtering and subsequently annealed in vacuum up to a temperature of 1200 °C and analyzed by X-ray diffraction. The obtained body-centered cubic structure in the as-deposited state remained stable up to the maximum annealing temperature. Measurements of the residual stress by wafer curvature and sin 2Ψ method revealed a general reduction of the stress with annealing temperature due to defect annihilation.

OriginalspracheEnglisch
Aufsatznummer129189
Seitenumfang7
FachzeitschriftSurface & coatings technology
Jahrgang454.2023
Ausgabenummer15 February
Frühes Online-Datum23 Dez. 2022
DOIs
PublikationsstatusVeröffentlicht - 15 Feb. 2023

Bibliographische Notiz

Funding Information:
The authors acknowledge the funding from the Austrian Research Promotion Agency (FFG) (project number: 871687). A. Lassnig acknowledges funding from the Austrian Science Fund (FWF) (project number T891-N36). The authors are grateful to S. Wurster (Austrian Academy of Sciences, Austria) for the SEM investigations. G.C. Gruber thanks S. Hirn (Montanuniversität Leoben, Austria) for the help with the depositions.

Funding Information:
The authors acknowledge the funding from the Austrian Research Promotion Agency (FFG) (project number: 871687 ). A. Lassnig acknowledges funding from the Austrian Science Fund (FWF) (project number T891-N36 ). The authors are grateful to S. Wurster (Austrian Academy of Sciences, Austria) for the SEM investigations. G.C. Gruber thanks S. Hirn (Montanuniversität Leoben, Austria) for the help with the depositions.

Publisher Copyright:
© 2022 The Authors

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