Thermomechanical and Electrical Material Characterization for a DLP Printing Process Simulation of Electrically Conductive Parts

A. Thalhamer, E. Rossegger, S. Hasil, K. Hrbinic, V. Feigl, M. Pfost, P. Fuchs

Publikation: Beitrag in Buch/Bericht/KonferenzbandBeitrag in Konferenzband

OriginalspracheEnglisch
Titel2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023
Herausgeber (Verlag)Institute of Electrical and Electronics Engineers
ISBN (elektronisch)9798350345971
DOIs
PublikationsstatusVeröffentlicht - 2023
Veranstaltung24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023 - Graz, Österreich
Dauer: 16 Apr. 202319 Apr. 2023

Publikationsreihe

Name2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023

Konferenz

Konferenz24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023
Land/GebietÖsterreich
OrtGraz
Zeitraum16/04/2319/04/23

Bibliographische Notiz

Funding Information:
The research work was performed within the COMET-Module project “Chemitecture” (project-no.: 21647048) at the Polymer Competence Center Leoben GmbH (PCCL, Austria) within the framework of the COMET-program of the Federal Ministry for Transport, Innovation and Technology and the Federal Ministry for Digital and Economic Affairs with contributions by Montanuniversität Leoben, Technische Universität Dortmund, BTO-Epoxy GmbH, In-Vision Technologies AG and TDK Electronics AG. The PCCL is funded by the Austrian Government and the State Governments of Styria, Lower Austria and Upper Austria.

Publisher Copyright:
© 2023 IEEE.

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