Originalsprache | Englisch |
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Titel | 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023 |
Herausgeber (Verlag) | Institute of Electrical and Electronics Engineers |
ISBN (elektronisch) | 9798350345971 |
DOIs | |
Publikationsstatus | Veröffentlicht - 2023 |
Veranstaltung | 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023 - Graz, Österreich Dauer: 16 Apr. 2023 → 19 Apr. 2023 |
Publikationsreihe
Name | 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023 |
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Konferenz
Konferenz | 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023 |
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Land/Gebiet | Österreich |
Ort | Graz |
Zeitraum | 16/04/23 → 19/04/23 |
Bibliographische Notiz
Funding Information:The research work was performed within the COMET-Module project “Chemitecture” (project-no.: 21647048) at the Polymer Competence Center Leoben GmbH (PCCL, Austria) within the framework of the COMET-program of the Federal Ministry for Transport, Innovation and Technology and the Federal Ministry for Digital and Economic Affairs with contributions by Montanuniversität Leoben, Technische Universität Dortmund, BTO-Epoxy GmbH, In-Vision Technologies AG and TDK Electronics AG. The PCCL is funded by the Austrian Government and the State Governments of Styria, Lower Austria and Upper Austria.
Publisher Copyright:
© 2023 IEEE.