Thermomechanical and Electrical Material Characterization for a DLP Printing Process Simulation of Electrically Conductive Parts

Andreas Thalhamer; Elisabeth Rossegger; S. Hasil; Katja Hrbinič; Viktoria Feigl; M. Pfost; P.F. Fuchs

Thermomechanical and Electrical Material Characterization for a DLP Printing Process Simulation of Electrically Conductive Parts

Andreas Thalhamer, Elisabeth Rossegger, S. Hasil, Katja Hrbinič, Viktoria Feigl, M. Pfost, P.F. Fuchs

Lehrstuhl für Chemie der Kunststoffe (231)

Publikation: Konferenzbeitrag › Poster › Forschung

Originalsprache	Englisch
Publikationsstatus	Veröffentlicht - 2023
Veranstaltung	24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023 - Graz, Österreich Dauer: 16 Apr. 2023 → 19 Apr. 2023

Konferenz

Konferenz	24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023
Land/Gebiet	Österreich
Ort	Graz
Zeitraum	16/04/23 → 19/04/23

Dieses zitieren

Thalhamer, A., Rossegger, E., Hasil, S., Hrbinič, K., Feigl, V., Pfost, M., & Fuchs, P. F. (2023). Thermomechanical and Electrical Material Characterization for a DLP Printing Process Simulation of Electrically Conductive Parts. Postersitzung präsentiert bei 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023, Graz, Österreich.

Thalhamer, Andreas ; Rossegger, Elisabeth ; Hasil, S. et al. / Thermomechanical and Electrical Material Characterization for a DLP Printing Process Simulation of Electrically Conductive Parts. Postersitzung präsentiert bei 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023, Graz, Österreich.

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title = "Thermomechanical and Electrical Material Characterization for a DLP Printing Process Simulation of Electrically Conductive Parts",

author = "Andreas Thalhamer and Elisabeth Rossegger and S. Hasil and Katja Hrbini{\v c} and Viktoria Feigl and M. Pfost and P.F. Fuchs",

year = "2023",

language = "English",

note = "24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023 ; Conference date: 16-04-2023 Through 19-04-2023",

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Thalhamer, A, Rossegger, E, Hasil, S, Hrbinič, K, Feigl, V, Pfost, M & Fuchs, PF 2023, 'Thermomechanical and Electrical Material Characterization for a DLP Printing Process Simulation of Electrically Conductive Parts', 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023, Graz, Österreich, 16/04/23 - 19/04/23.

Thermomechanical and Electrical Material Characterization for a DLP Printing Process Simulation of Electrically Conductive Parts. / Thalhamer, Andreas; Rossegger, Elisabeth; Hasil, S. et al.
2023. Postersitzung präsentiert bei 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023, Graz, Österreich.

Publikation: Konferenzbeitrag › Poster › Forschung

TY - CONF

T1 - Thermomechanical and Electrical Material Characterization for a DLP Printing Process Simulation of Electrically Conductive Parts

AU - Thalhamer, Andreas

AU - Rossegger, Elisabeth

AU - Hasil, S.

AU - Hrbinič, Katja

AU - Feigl, Viktoria

AU - Pfost, M.

AU - Fuchs, P.F.

PY - 2023

Y1 - 2023

M3 - Poster

T2 - 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023

Y2 - 16 April 2023 through 19 April 2023

ER -

Thalhamer A, Rossegger E, Hasil S, Hrbinič K, Feigl V, Pfost M et al.. Thermomechanical and Electrical Material Characterization for a DLP Printing Process Simulation of Electrically Conductive Parts. 2023. Postersitzung präsentiert bei 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023, Graz, Österreich.