15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014

  • Katerina Macurova (Speaker)

Activity: Participating in or organising an event › Participation in conference

Description

Simulation of stress distribution in assembled silicon dies and deflection of printed circuit boards
Period7 Apr 2014 → 9 Apr 2014
Event typeConference
LocationGent, BelgiumShow on map