Combining high strength, ductility and toughness in interface-doped W-Cu nanocomposites
- Michael Wurmshuber (Speaker)
- Schmuck, K. S. (contributor)
- Simon Doppermann (contributor)
- Burtscher, M. (contributor)
- Rishi Bodlos (contributor)
- Romaner, L. (contributor)
- Kiener, D. (contributor)
Activity: Talk or presentation › Oral presentation