Combining high strength, ductility and toughness in interface-doped W-Cu nanocomposites

  • Kiener, D. (Invited speaker)
  • Michael Wurmshuber (Speaker)
  • Klemens Silvester Schmuck (contributor)
  • Inas Issa (contributor)
  • Burtscher, M. (contributor)

Activity: Talk or presentation › Oral presentation

Period3 Dec 2021
Event titleInternational Conference on Advanced Materials and Mechanical Characterization
Event typeConference
LocationIndiaShow on map