A comprehensive methodology for criticality assessment of microvias in printed circuit board assemblies

Vikram G. Kamble, Dhaval Rasheshkumar Patel, Christian Schipfer, Andreas Thalhamer, Julia Zuendel, Thomas Krivec, Thomas Antretter, Peter Filipp Fuchs

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Original languageEnglish
Title of host publication2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024
PublisherInstitute of Electrical and Electronics Engineers
ISBN (Electronic)9798350393637
DOIs
Publication statusPublished - 2024
Event25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024 - Catania, Italy
Duration: 7 Apr 202410 Apr 2024

Publication series

Name2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024

Conference

Conference25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024
Country/TerritoryItaly
CityCatania
Period7/04/2410/04/24

Bibliographical note

Publisher Copyright:
© 2024 IEEE.

Keywords

  • Criticality Assessment
  • Finite Element Analysis (FEA)
  • Microelectronics
  • Microvia
  • Printed Circuit Board Assembly (PCBA)
  • Reliability
  • Via

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