A Simulation-Based Assessment of Print Accuracy for Microelectronic Parts Manufactured with DLP 3D Printing Process

A. Thalhamer; P. Fuchs; L. Strohmeier; S. Hasil; A. Wolfberger

doi:10.1109/EuroSimE54907.2022.9758869

A Simulation-Based Assessment of Print Accuracy for Microelectronic Parts Manufactured with DLP 3D Printing Process

A. Thalhamer
, P. Fuchs
, L. Strohmeier
, S. Hasil
, A. Wolfberger

Polymer Competence Center Leoben GmbH

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Original language	English
Title of host publication	2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022
Publisher	Institute of Electrical and Electronics Engineers
ISBN (Electronic)	9781665458368
DOIs	https://doi.org/10.1109/EuroSimE54907.2022.9758869
Publication status	Published - 2022
Event	23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022 - St Julian, Malta Duration: 25 Apr 2022 → 27 Apr 2022

Publication series

Name	2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022

Conference

Conference	23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022
Country/Territory	Malta
City	St Julian
Period	25/04/22 → 27/04/22

Bibliographical note

Publisher Copyright:
© 2022 IEEE.

Access to Document

10.1109/EuroSimE54907.2022.9758869

Cite this

Thalhamer, A., Fuchs, P., Strohmeier, L., Hasil, S., & Wolfberger, A. (2022). A Simulation-Based Assessment of Print Accuracy for Microelectronic Parts Manufactured with DLP 3D Printing Process. In 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022 (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022). Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/EuroSimE54907.2022.9758869

Thalhamer, A. ; Fuchs, P. ; Strohmeier, L. et al. / A Simulation-Based Assessment of Print Accuracy for Microelectronic Parts Manufactured with DLP 3D Printing Process. 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers, 2022. (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022).

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title = "A Simulation-Based Assessment of Print Accuracy for Microelectronic Parts Manufactured with DLP 3D Printing Process",

author = "A. Thalhamer and P. Fuchs and L. Strohmeier and S. Hasil and A. Wolfberger",

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Thalhamer, A, Fuchs, P, Strohmeier, L, Hasil, S & Wolfberger, A 2022, A Simulation-Based Assessment of Print Accuracy for Microelectronic Parts Manufactured with DLP 3D Printing Process. in 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022, Institute of Electrical and Electronics Engineers, 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022, St Julian, Malta, 25/04/22. https://doi.org/10.1109/EuroSimE54907.2022.9758869

A Simulation-Based Assessment of Print Accuracy for Microelectronic Parts Manufactured with DLP 3D Printing Process. / Thalhamer, A.; Fuchs, P.; Strohmeier, L. et al.
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers, 2022. (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - A Simulation-Based Assessment of Print Accuracy for Microelectronic Parts Manufactured with DLP 3D Printing Process

AU - Thalhamer, A.

AU - Fuchs, P.

AU - Strohmeier, L.

AU - Hasil, S.

AU - Wolfberger, A.

PY - 2022

Y1 - 2022

UR - https://www.scopus.com/pages/publications/85129524836

U2 - 10.1109/EuroSimE54907.2022.9758869

DO - 10.1109/EuroSimE54907.2022.9758869

M3 - Conference contribution

AN - SCOPUS:85129524836

T3 - 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022

BT - 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022

PB - Institute of Electrical and Electronics Engineers

T2 - 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022

Y2 - 25 April 2022 through 27 April 2022

ER -

Thalhamer A, Fuchs P, Strohmeier L, Hasil S, Wolfberger A. A Simulation-Based Assessment of Print Accuracy for Microelectronic Parts Manufactured with DLP 3D Printing Process. In 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers. 2022. (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022). doi: 10.1109/EuroSimE54907.2022.9758869

A Simulation-Based Assessment of Print Accuracy for Microelectronic Parts Manufactured with DLP 3D Printing Process

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