Advanced characterisation of thermo-mechanical fatigue mechanisms of different copper film systems for wafer metallizations

Stephan Bigl, Stefan Wurster, Megan Cordill, Daniel Kiener

Research output: Contribution to journalArticleResearchpeer-review

13 Citations (Scopus)
Original languageEnglish
Pages (from-to)153-164
Number of pages12
JournalThin solid films
Issue number1 August
Publication statusPublished - 1 Aug 2016


  • Copper metallization
  • Inorganic impurities
  • Small angle grain boundary formation
  • Surface roughening
  • Thermo-mechanical fatigue
  • Twin boundary migration
  • Void formation

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