Au–Sn solders applied in transient liquid phase bonding: Microstructure and mechanical behavior

Chaowei Du, Rafael Soeler, Bernhard Völker, Kurt Matoy, Johannes Zechner, Gregor Langer, Michael Reisinger, Juraj Todt, Christoph Kirchlechner, Gerhard Dehm

Research output: Contribution to journalArticleResearchpeer-review

3 Citations (Scopus)
Original languageEnglish
Article number100503
JournalMaterialia
Volume8.2019
Early online date10 Oct 2019
DOIs
Publication statusPublished - 1 Dec 2019
Externally publishedYes

Keywords

  • Au–Sn solder
  • Fracture toughness
  • Micro-bending
  • Micro-cantilever testing

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