@article{d7b66c7449ee48529b4b343c6d296372,
title = "Backside metallization affects residual stress and bending strength of the recast layer in laser-diced Si",
keywords = "Die bending strength, Local residual stresses, Nanosecond laser dicing, Ultra-thin Si dies, X-ray nanodiffraction",
author = "T. Ziegelwanger and M. Reisinger and K. Matoy and Medjahed, {A. A.} and J. Zalesak and Manuel Gruber and M. Meindlhumer and J. Keckes",
note = "Publisher Copyright: {\textcopyright} 2024",
year = "2024",
month = oct,
doi = "10.1016/j.mssp.2024.108579",
language = "English",
volume = "181",
journal = "Materials Science in Semiconductor Processing",
issn = "1369-8001",
publisher = "Elsevier Ltd",
}