For technical applications electronic components are embedded in polymer to insulate and protect them from any harsh environmental conditions that influence their functionality. Within this process randomly distributed voids in the matrix can form and remain after curing is completed. Furthermore the material has to be sterilised in an autoclave. To this end the material is heated up to clean its surface with steam. After heating stresses appear around the voids, which can cause damage to the material. To prevent catastrophic component failure the risk potential of the voids has to be analysed and clarified. To this end randomized geometries of voids are generated and the probability of failure is statistically analysed. This thesis shall provide a basis for non-destructive testing as is frequently used in medical engineering.
|Translated title of the contribution||Assessment of the risk potential of pore formation in polymers during the embedding of electronic components in medical engineering|
|Award date||7 Apr 2017|
|Publication status||Published - 2017|
Bibliographical noteembargoed until 28-02-2022
- probability of failure
- finite elements
- thermomechanical analysis