Bonding at copper–alumina interfaces established by different surface treatments: a critical review

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Translated title of the contribution	Bonding at copper–alumina interfaces established by different surface treatments: a critical review
Original language	English
Pages (from-to)	5161-5168
Journal	Journal of materials science
Volume	41
DOIs	https://doi.org/10.1007/s10853-006-0073-0
Publication status	Published - 2006

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@article{9509e478da8b4be3b2de2844d39c7392,

title = "Bonding at copper–alumina interfaces established by different surface treatments: a critical review",

author = "Christina Scheu and M. Gao and S.H. Oh and Gerhard Dehm and S. Klein and A.P. Tomsia and M. R{\"u}hle",

year = "2006",

doi = "10.1007/s10853-006-0073-0",

language = "English",

volume = "41",

pages = "5161--5168",

journal = "Journal of materials science",

issn = "0022-2461",

publisher = "Springer",

}

TY - JOUR

T1 - Bonding at copper–alumina interfaces established by different surface treatments: a critical review

AU - Scheu, Christina

AU - Gao, M.

AU - Oh, S.H.

AU - Dehm, Gerhard

AU - Klein, S.

AU - Tomsia, A.P.

AU - Rühle, M.

PY - 2006

Y1 - 2006

U2 - 10.1007/s10853-006-0073-0

DO - 10.1007/s10853-006-0073-0

M3 - Article

SN - 0022-2461

VL - 41

SP - 5161

EP - 5168

JO - Journal of materials science

JF - Journal of materials science

ER -