| Original language | English |
|---|---|
| Pages (from-to) | 63-68 |
| Number of pages | 6 |
| Journal | Microelectronic engineering |
| Volume | 167.2017 |
| Issue number | 5 January |
| Publication status | E-pub ahead of print - 2 Nov 2016 |
Buckle induced delamination techniques to measure the adhesion of metal dielectric interfaces
Andreas Kleinbichler, J. Zechner, Megan Cordill
Research output: Contribution to journal › Article › Research › peer-review
17
Citations
(Scopus)