Buckle induced delamination techniques to measure the adhesion of metal dielectric interfaces

Research output: Contribution to journal › Article › Research › peer-review

17 Citations (Scopus)

Original language	English
Pages (from-to)	63-68
Number of pages	6
Journal	Microelectronic engineering
Volume	167.2017
Issue number	5 January
Publication status	E-pub ahead of print - 2 Nov 2016

Cite this

@article{c50d23c1fc99469086876211a14e65e6,

title = "Buckle induced delamination techniques to measure the adhesion of metal dielectric interfaces",

author = "Andreas Kleinbichler and J. Zechner and Megan Cordill",

year = "2016",

month = nov,

day = "2",

language = "English",

volume = "167.2017",

pages = "63--68",

journal = "Microelectronic engineering",

issn = "0167-9317",

publisher = "Elsevier B.V.",

number = "5 January",

}