Can micro-compression testing provide stress-strain data for thin films? A comparative study using Cu, VN, TiN and W coatings

Gerhard Dehm; Hans-Peter Wörgötter; Sophie Cazottes; Jaya M. Purswani; Daniel Gall; Christian Mitterer; Daniel Kiener

doi:10.1016/j.tsf.2009.09.070

Can micro-compression testing provide stress-strain data for thin films? A comparative study using Cu, VN, TiN and W coatings

Gerhard Dehm, Hans-Peter Wörgötter, Sophie Cazottes, Jaya M. Purswani, Daniel Gall, Christian Mitterer, Daniel Kiener

Chair of Materials Physics (430)

Research output: Contribution to journal › Article › Research › peer-review

17 Citations (Scopus)

Translated title of the contribution	Can micro-compression testing provide stress-strain data for thin films?: A comparative study using Cu, VN, TiN and W coatings
Original language	English
Pages (from-to)	1517-1521
Journal	Thin solid films
Volume	518
DOIs	https://doi.org/10.1016/j.tsf.2009.09.070
Publication status	Published - 2009

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10.1016/j.tsf.2009.09.070

Cite this

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title = "Can micro-compression testing provide stress-strain data for thin films? A comparative study using Cu, VN, TiN and W coatings",

author = "Gerhard Dehm and Hans-Peter W{\"o}rg{\"o}tter and Sophie Cazottes and Purswani, {Jaya M.} and Daniel Gall and Christian Mitterer and Daniel Kiener",

year = "2009",

doi = "10.1016/j.tsf.2009.09.070",

language = "English",

volume = "518",

pages = "1517--1521",

journal = "Thin solid films",

issn = "0040-6090",

publisher = "Elsevier",

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TY - JOUR

T1 - Can micro-compression testing provide stress-strain data for thin films? A comparative study using Cu, VN, TiN and W coatings

AU - Dehm, Gerhard

AU - Wörgötter, Hans-Peter

AU - Cazottes, Sophie

AU - Purswani, Jaya M.

AU - Gall, Daniel

AU - Mitterer, Christian

AU - Kiener, Daniel

PY - 2009

Y1 - 2009

U2 - 10.1016/j.tsf.2009.09.070

DO - 10.1016/j.tsf.2009.09.070

M3 - Article

SN - 0040-6090

VL - 518

SP - 1517

EP - 1521

JO - Thin solid films

JF - Thin solid films

ER -