@inproceedings{a33717d6919b42a188643937b0e30c7b,
title = "Characterization and modeling of a typical curing material for photoresist films",
author = "Chongnan Peng and Matthias Morak and Andreas Thalhamer and Mario Gschwandl and Peter Fuchs and Qi Tao and Thomas Krivec and Thomas Antretter and Celigueta, {Miguel Angel}",
note = "Publisher Copyright: {\textcopyright} 2022 IEEE.; 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022 ; Conference date: 25-04-2022 Through 27-04-2022",
year = "2022",
doi = "10.1109/EuroSimE54907.2022.9758849",
language = "English",
series = "2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022",
publisher = "Institute of Electrical and Electronics Engineers",
booktitle = "2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022",
address = "United States",
}