Characterization and modeling of the AuSnCu thin solder joint under thermal cycling

Thomas Antretter; Ralf Otremba; Balamurugan Karunamurthy; Tiphaine Pélisset

Characterization and modeling of the AuSnCu thin solder joint under thermal cycling

Thomas Antretter
, Ralf Otremba
, Balamurugan Karunamurthy
, Tiphaine Pélisset

Chair of Mechanics (400)

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Original language	English
Title of host publication	Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014
Publisher	G.Q. Zhang, W.D. Van Driel, P. Rodgers, C. Bailey, O. de Saint Leger
ISBN (Print)	978-1-4799-4791-1
Publication status	Published - 2014

Cite this

Antretter, T., Otremba, R., Karunamurthy, B., & Pélisset, T. (2014). Characterization and modeling of the AuSnCu thin solder joint under thermal cycling. In Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014 G.Q. Zhang, W.D. Van Driel, P. Rodgers, C. Bailey, O. de Saint Leger.

Antretter, Thomas ; Otremba, Ralf ; Karunamurthy, Balamurugan et al. / Characterization and modeling of the AuSnCu thin solder joint under thermal cycling. Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014. G.Q. Zhang, W.D. Van Driel, P. Rodgers, C. Bailey, O. de Saint Leger, 2014.

@inproceedings{ff2394b8a515435c8acf5aa7bbb36253,

title = "Characterization and modeling of the AuSnCu thin solder joint under thermal cycling",

author = "Thomas Antretter and Ralf Otremba and Balamurugan Karunamurthy and Tiphaine P{\'e}lisset",

year = "2014",

language = "English",

isbn = "978-1-4799-4791-1",

booktitle = "Proceedings of the 15th International Conference on Thermal, Mechanical \& Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014",

publisher = "G.Q. Zhang, W.D. Van Driel, P. Rodgers, C. Bailey, O. de Saint Leger",

}

Antretter, T, Otremba, R, Karunamurthy, B & Pélisset, T 2014, Characterization and modeling of the AuSnCu thin solder joint under thermal cycling. in Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014. G.Q. Zhang, W.D. Van Driel, P. Rodgers, C. Bailey, O. de Saint Leger.

Characterization and modeling of the AuSnCu thin solder joint under thermal cycling. / Antretter, Thomas; Otremba, Ralf; Karunamurthy, Balamurugan et al.
Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014. G.Q. Zhang, W.D. Van Driel, P. Rodgers, C. Bailey, O. de Saint Leger, 2014.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Characterization and modeling of the AuSnCu thin solder joint under thermal cycling

AU - Antretter, Thomas

AU - Otremba, Ralf

AU - Karunamurthy, Balamurugan

AU - Pélisset, Tiphaine

PY - 2014

Y1 - 2014

M3 - Conference contribution

SN - 978-1-4799-4791-1

BT - Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014

PB - G.Q. Zhang, W.D. Van Driel, P. Rodgers, C. Bailey, O. de Saint Leger

ER -

Antretter T, Otremba R, Karunamurthy B, Pélisset T. Characterization and modeling of the AuSnCu thin solder joint under thermal cycling. In Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014. G.Q. Zhang, W.D. Van Driel, P. Rodgers, C. Bailey, O. de Saint Leger. 2014