Characterization of the damping behavior of thin films with dynamic mechanic analysis in bending mode

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Translated title of the contribution	Characterization of the damping behavior of thin films with dynamic mechanic analysis in bending mode
Original language	English
Title of host publication	ASME 2014 International Mechanical Engineering Congress & Exposition
Pages	1-7
Publication status	Published - 2014

Cite this

@inproceedings{78ba4a9db269465c846c592e27a0f35f,

title = "Characterization of the damping behavior of thin films with dynamic mechanic analysis in bending mode",

author = "Gilbert Knapp and M Leyrer and Gernot Oreski and Gerald Pinter",

year = "2014",

language = "English",

pages = "1--7",

booktitle = "ASME 2014 International Mechanical Engineering Congress \& Exposition",

}