Copper/Epoxy Joints in Printed Circuit Boards: Manufacturing and Interfacial Failure Mechanisms

Philipp Nothdurft, Gisbert Rieß, Wolfgang Kern

Research output: Contribution to journalReview articlepeer-review

12 Citations (Scopus)


Printed circuit boards (PCBs) have a wide range of applications in electronics where they are used for electric signal transfer. For a multilayer build-up, thin copper foils are alternated with epoxy-based prepregs and laminated to each other. Adhesion between copper and epoxy composites is achieved by technologies based on mechanical interlocking or chemical bonding, however for future development, the understanding of failure mechanisms between these materials is of high importance. In literature, various interfacial failures are reported which lead to adhesion loss between copper and epoxy resins. This review aims to give an overview on common coupling technologies and possible failure mechanisms. The information reviewed can in turn lead to the development of new strategies, enhancing the adhesion strength of copper/epoxy joints and, therefore, establishing a basis for future PCB manufacturing.
Original languageEnglish
Article number550
Number of pages18
Issue number3
Publication statusPublished - 12 Feb 2019


  • Circuit boards
  • Copper/epoxy joints
  • Electronic industry
  • Failure analysis
  • Printed
  • State of the art

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