Crack deflection in multi-layered four-point bending samples

Four-point bending experiments are conceptually the method of choice when investigating the delamination strength of multi-layered components, which are of particular interest for semiconductor applications. However, experimental studies have shown that the crack continues as mode-I crack in most cases while delamination is rarely observed, thus making the four-point bending method useless. This study uses the finite element method with cohesive zones to study crack propagation and the likelihood of turning the initial mode-I crack into a delamination crack in a multi-layered structure. We close with a conclusion which can help to increase the delamination probability and thereby help to determine the delamination strengths of layered structures.