Design independent lifetime assessment method for PCBs under low cycle fatigue loading conditions

Translated title of the contribution: Design independent lifetime assessment method for PCBs under low cycle fatigue loading conditions

Peter F. Fuchs, Gerald Pinter, Thomas Krivec

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Translated title of the contribution	Design independent lifetime assessment method for PCBs under low cycle fatigue loading conditions
Original language	German
Title of host publication	15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
Pages	1-8
Publication status	Published - 2014

Cite this

@inproceedings{09b6b10d0374428fb3999a2f78b52ba5,

title = "Design independent lifetime assessment method for PCBs under low cycle fatigue loading conditions",

author = "Fuchs, {Peter F.} and Gerald Pinter and Thomas Krivec",

year = "2014",

language = "Deutsch",

pages = "1--8",

booktitle = "15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems",

}

Design independent lifetime assessment method for PCBs under low cycle fatigue loading conditions. / Fuchs, Peter F.; Pinter, Gerald; Krivec, Thomas.
15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. 2014. p. 1-8.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Design independent lifetime assessment method for PCBs under low cycle fatigue loading conditions

AU - Fuchs, Peter F.

AU - Pinter, Gerald

AU - Krivec, Thomas

PY - 2014

Y1 - 2014

M3 - Beitrag in Konferenzband

SP - 1

EP - 8

BT - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

ER -