Design of multilayer metallization to reduce mechanical loading: Effect of growth conditions on interface stability and thermo-mechanical properties of sputtered Cu films on Si with and without WTi barrier layers

Imane Souli, Velislava Terziyska, Jozef Keckes, Josef Zechner, Christian Mitterer

Research output: Contribution to conference › Presentation › Research

  • 1 Participation in conference

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