Determination of cyclic mechanical properties of thin copper layers for PCB applications

Klaus Fellner; Peter F. Fuchs; Thomas Antretter; Gerald Pinter; Ronald Schöngrundner

Determination of cyclic mechanical properties of thin copper layers for PCB applications

Klaus Fellner
, Peter F. Fuchs
, Thomas Antretter
, Gerald Pinter
, Ronald Schöngrundner

Chair of Mechanics (400)

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

8 Citations (Scopus)

Translated title of the contribution	Determination of cyclic mechanical properties of thin copper layers for PCB applications
Original language	English
Title of host publication	Proceedings 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
Publisher	G.Q. Zhang, W.D. Van Driel, P. Rodgers, C. Bailey, O. de Saint Leger
Pages	1-8
ISBN (Print)	978-1-4799-4791-1
Publication status	Published - 2014

Cite this

Fellner, K., Fuchs, P. F., Antretter, T., Pinter, G., & Schöngrundner, R. (2014). Determination of cyclic mechanical properties of thin copper layers for PCB applications. In Proceedings 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (pp. 1-8). G.Q. Zhang, W.D. Van Driel, P. Rodgers, C. Bailey, O. de Saint Leger.

Fellner, Klaus ; Fuchs, Peter F. ; Antretter, Thomas et al. / Determination of cyclic mechanical properties of thin copper layers for PCB applications. Proceedings 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. G.Q. Zhang, W.D. Van Driel, P. Rodgers, C. Bailey, O. de Saint Leger, 2014. pp. 1-8

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title = "Determination of cyclic mechanical properties of thin copper layers for PCB applications",

author = "Klaus Fellner and Fuchs, \{Peter F.\} and Thomas Antretter and Gerald Pinter and Ronald Sch{\"o}ngrundner",

year = "2014",

language = "English",

isbn = "978-1-4799-4791-1",

pages = "1--8",

booktitle = "Proceedings 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems",

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Fellner, K, Fuchs, PF, Antretter, T , Pinter, G & Schöngrundner, R 2014, Determination of cyclic mechanical properties of thin copper layers for PCB applications. in Proceedings 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. G.Q. Zhang, W.D. Van Driel, P. Rodgers, C. Bailey, O. de Saint Leger, pp. 1-8.

Determination of cyclic mechanical properties of thin copper layers for PCB applications. / Fellner, Klaus; Fuchs, Peter F.; Antretter, Thomas et al.
Proceedings 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. G.Q. Zhang, W.D. Van Driel, P. Rodgers, C. Bailey, O. de Saint Leger, 2014. p. 1-8.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Determination of cyclic mechanical properties of thin copper layers for PCB applications

AU - Fellner, Klaus

AU - Fuchs, Peter F.

AU - Antretter, Thomas

AU - Pinter, Gerald

AU - Schöngrundner, Ronald

PY - 2014

Y1 - 2014

M3 - Conference contribution

SN - 978-1-4799-4791-1

SP - 1

EP - 8

BT - Proceedings 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

PB - G.Q. Zhang, W.D. Van Driel, P. Rodgers, C. Bailey, O. de Saint Leger

ER -

Fellner K, Fuchs PF, Antretter T , Pinter G, Schöngrundner R. Determination of cyclic mechanical properties of thin copper layers for PCB applications. In Proceedings 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. G.Q. Zhang, W.D. Van Driel, P. Rodgers, C. Bailey, O. de Saint Leger. 2014. p. 1-8