Development of a coating process for copper strips with appropriate lead-free solders

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Translated title of the contribution	Development of a coating process for copper strips with appropriate lead-free solders
Original language	English
Title of host publication	European Metallurgical Conference EMC 2011 / Band 1 Copper; General Pyrometallurgy; Vessel Integrity; Process Gas Treatment
Pages	1161-1170
Publication status	Published - 2011

Cite this

@inproceedings{90d75a6886cf4651a6dd6027e6ec5c98,

title = "Development of a coating process for copper strips with appropriate lead-free solders",

author = "Stefan Pogatscher and Susanne Koch and Helmut Antrekowitsch",

year = "2011",

language = "English",

isbn = "978-3-940276-36-0",

pages = "1161--1170",

booktitle = "European Metallurgical Conference EMC 2011 / Band 1 Copper; General Pyrometallurgy; Vessel Integrity; Process Gas Treatment",

}

Development of a coating process for copper strips with appropriate lead-free solders. / Pogatscher, Stefan; Koch, Susanne; Antrekowitsch, Helmut.
European Metallurgical Conference EMC 2011 / Band 1 Copper; General Pyrometallurgy; Vessel Integrity; Process Gas Treatment. 2011. p. 1161-1170.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Development of a coating process for copper strips with appropriate lead-free solders

AU - Pogatscher, Stefan

AU - Koch, Susanne

AU - Antrekowitsch, Helmut

PY - 2011

Y1 - 2011

M3 - Conference contribution

SN - 978-3-940276-36-0

SP - 1161

EP - 1170

BT - European Metallurgical Conference EMC 2011 / Band 1 Copper; General Pyrometallurgy; Vessel Integrity; Process Gas Treatment

ER -