Development of thin-walled MIM parts

C. G. Kukla, E. Griesmayer, B. Zlatkov

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A cooling device for the thermal management for CPUs is developed. The construction material is copper. This cooling device shows an aspect ratio higher than 100 and very thin wall-thicknesses. Regarding the manufacturing process it is a very demanding product. For the first prototype electroplating was used. Because of the complex shape and the machining process involved this first approach is not feasible for mass production. Therefore MIM was chosen as a proper manufacturing technology. A test mould was designed and constructed to check certain parameters regarding mould design, the injection moulding process and sintering. For injection moulding the Variomold process had to be used. Finally first parts were produced and tested regarding their efficiency for cooling.
Original languageEnglish
Title of host publicationEuro PM 2005
Subtitle of host publicationPowder Metallurgy Congress and Exhibition
PublisherEuropean Powder Metallurgy Association (EPMA)
Pages405-410
Number of pages6
ISBN (Print)9781899072187
Publication statusPublished - 1 Jan 2005
Externally publishedYes
EventEuropean Powder Metallurgy Congress and Exhibition, Euro PM 2005 - Prague, Czech Republic
Duration: 2 Oct 20055 Oct 2005

Publication series

NameEuro PM 2005: Powder Metallurgy Congress and Exhibition
Volume2

Conference

ConferenceEuropean Powder Metallurgy Congress and Exhibition, Euro PM 2005
Country/TerritoryCzech Republic
CityPrague
Period2/10/055/10/05

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