| Original language | English |
|---|---|
| Title of host publication | 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021 |
| Publisher | Institute of Electrical and Electronics Engineers |
| ISBN (Electronic) | 9781665413732 |
| DOIs | |
| Publication status | Published - 19 Apr 2021 |
| Event | 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021 - St. Julian, Malta Duration: 19 Apr 2021 → 21 Apr 2021 |
Publication series
| Name | 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021 |
|---|
Conference
| Conference | 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021 |
|---|---|
| Country/Territory | Malta |
| City | St. Julian |
| Period | 19/04/21 → 21/04/21 |
Bibliographical note
Publisher Copyright:© 2021 IEEE.
UN SDGs
This output contributes to the following UN Sustainable Development Goals (SDGs)
-
SDG 7 Affordable and Clean Energy
-
SDG 13 Climate Action
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