Enhanced Ti0.84Ta0.16N diffusion barriers, grown by a hybrid sputtering technique with no substrate heating, between Si (001) wafers and Cu overlayers

Marlene Mühlbacher; Grzegorz Greczynski; Bernhard  Sartory; Nina Schalk; Jun Lu; Ivan Petrov; J.E. Greene; Lars Hultman; Christian Mitterer

doi:10.1038/s41598-018-23782-9

Enhanced Ti_0.84Ta_0.16N diffusion barriers, grown by a hybrid sputtering technique with no substrate heating, between Si (001) wafers and Cu overlayers

Marlene Mühlbacher
, Grzegorz Greczynski
, Bernhard Sartory
, Nina Schalk
, Jun Lu
, Ivan Petrov
, J.E. Greene
, Lars Hultman
, Christian Mitterer

Research output: Contribution to journal › Article › Research › peer-review

17 Citations (Scopus)

Original language	English
Pages (from-to)	1-9
Journal	Scientific reports (London : Nature Publishing Group)
DOIs	https://doi.org/10.1038/s41598-018-23782-9
Publication status	Published - 2018

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10.1038/s41598-018-23782-9Licence: CC BY

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Mühlbacher, M., Greczynski, G., Sartory, B., Schalk, N., Lu, J., Petrov, I., Greene, J. E., Hultman, L., & Mitterer, C. (2018). Enhanced Ti_0.84Ta_0.16N diffusion barriers, grown by a hybrid sputtering technique with no substrate heating, between Si (001) wafers and Cu overlayers. Scientific reports (London : Nature Publishing Group), 1-9. https://doi.org/10.1038/s41598-018-23782-9

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title = "Enhanced Ti0.84Ta0.16N diffusion barriers, grown by a hybrid sputtering technique with no substrate heating, between Si (001) wafers and Cu overlayers",

author = "Marlene M{\"u}hlbacher and Grzegorz Greczynski and Bernhard Sartory and Nina Schalk and Jun Lu and Ivan Petrov and J.E. Greene and Lars Hultman and Christian Mitterer",

year = "2018",

doi = "10.1038/s41598-018-23782-9",

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journal = "Scientific reports (London : Nature Publishing Group)",

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Mühlbacher, M, Greczynski, G, Sartory, B, Schalk, N, Lu, J, Petrov, I, Greene, JE, Hultman, L & Mitterer, C 2018, 'Enhanced Ti_0.84Ta_0.16N diffusion barriers, grown by a hybrid sputtering technique with no substrate heating, between Si (001) wafers and Cu overlayers', Scientific reports (London : Nature Publishing Group), pp. 1-9. https://doi.org/10.1038/s41598-018-23782-9

Enhanced Ti_0.84Ta_0.16N diffusion barriers, grown by a hybrid sputtering technique with no substrate heating, between Si (001) wafers and Cu overlayers. / Mühlbacher, Marlene; Greczynski, Grzegorz; Sartory, Bernhard et al.
In: Scientific reports (London : Nature Publishing Group), 2018, p. 1-9.

Research output: Contribution to journal › Article › Research › peer-review

TY - JOUR

T1 - Enhanced Ti0.84Ta0.16N diffusion barriers, grown by a hybrid sputtering technique with no substrate heating, between Si (001) wafers and Cu overlayers

AU - Mühlbacher, Marlene

AU - Greczynski, Grzegorz

AU - Sartory, Bernhard

AU - Schalk, Nina

AU - Lu, Jun

AU - Petrov, Ivan

AU - Greene, J.E.

AU - Hultman, Lars

AU - Mitterer, Christian

PY - 2018

Y1 - 2018

U2 - 10.1038/s41598-018-23782-9

DO - 10.1038/s41598-018-23782-9

M3 - Article

SN - 2045-2322

SP - 1

EP - 9

JO - Scientific reports (London : Nature Publishing Group)

JF - Scientific reports (London : Nature Publishing Group)

ER -