Estimation of the area and depth of buried heat sources: an approach to characterize defects in inductive and ultrasound excited thermography

Arantza Mendioroz, Agustín Salazar, Beate Oswald-Tranta, Christoph Tuschl

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Original languageEnglish
Title of host publicationThermosense
Subtitle of host publicationThermal Infrared Applications XLV
EditorsNicolas P. Avdelidis
PublisherSPIE
ISBN (Electronic)9781510661868
DOIs
Publication statusPublished - 2023
EventThermosense: Thermal Infrared Applications XLV 2023 - Orlando, United States
Duration: 2 May 20234 May 2023

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume12536
ISSN (Print)0277-786X
ISSN (Electronic)1996-756X

Conference

ConferenceThermosense: Thermal Infrared Applications XLV 2023
Country/TerritoryUnited States
CityOrlando
Period2/05/234/05/23

Bibliographical note

Publisher Copyright:
© 2023 SPIE.

Keywords

  • delaminations
  • inductive thermography
  • infrared thermography
  • nondestructive evaluation
  • tilted cracks

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