Evaluation of Digital Image Correlation Techniques for the Determination of Coefficients of Thermal Expansion for Thin Reinforced Polymers

Mario Gschwandl, Markus Frewein, Peter Filipp Fuchs, Thomas Antretter, Gerald Pinter, Philipp Novak

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Original languageEnglish
Title of host publicationEMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging
PublisherInstitute of Electrical and Electronics Engineers
ISBN (Electronic)9781538656426
ISBN (Print)9781538656426
DOIs
Publication statusPublished - 5 Mar 2019
Event20th International Conference on Electronic Materials and Packaging, EMAP 2018 - Clear Water Bay, Hong Kong
Duration: 17 Dec 201820 Dec 2018

Publication series

NameEMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging

Conference

Conference20th International Conference on Electronic Materials and Packaging, EMAP 2018
Country/TerritoryHong Kong
CityClear Water Bay
Period17/12/1820/12/18

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