Original language | English |
---|---|
Pages (from-to) | 17-22 |
Number of pages | 6 |
Journal | Journal of Microelectronics and Electronic Packaging |
Volume | 13 |
Issue number | 1 |
DOIs | |
Publication status | Published - 2016 |
Evaluation of Mechanical Strength of Miniaturized Functional Substrates and Components in Different Environments
Raul Bermejo, Clemens Krautgasser, Marco Deluca, Martin Pletz, Peter Supancic, Franz Aldrian, Robert Danzer
Research output: Contribution to journal › Article › Research › peer-review
1
Citation
(Scopus)