Evaluation of Mechanical Strength of Miniaturized Functional Substrates and Components in Different Environments

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Original language	English
Pages (from-to)	17-22
Number of pages	6
Journal	Journal of Microelectronics and Electronic Packaging
Volume	13
Issue number	1
DOIs	https://doi.org/10.4071/imaps.491
Publication status	Published - 2016

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title = "Evaluation of Mechanical Strength of Miniaturized Functional Substrates and Components in Different Environments",

author = "Raul Bermejo and Clemens Krautgasser and Marco Deluca and Martin Pletz and Peter Supancic and Franz Aldrian and Robert Danzer",

year = "2016",

doi = "10.4071/imaps.491",

language = "English",

volume = "13",

pages = "17--22",

journal = "Journal of Microelectronics and Electronic Packaging",

publisher = "IMAPS-International Microelectronics and Packaging Society",

number = "1",

}

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T1 - Evaluation of Mechanical Strength of Miniaturized Functional Substrates and Components in Different Environments

AU - Bermejo, Raul

AU - Krautgasser, Clemens

AU - Deluca, Marco

AU - Pletz, Martin

AU - Supancic, Peter

AU - Aldrian, Franz

AU - Danzer, Robert

PY - 2016

Y1 - 2016

U2 - 10.4071/imaps.491

DO - 10.4071/imaps.491

M3 - Article

VL - 13

SP - 17

EP - 22

JO - Journal of Microelectronics and Electronic Packaging

JF - Journal of Microelectronics and Electronic Packaging

IS - 1

ER -