Fracture and Material Behavior of Thin Film composites

Darjan Kozic; Ruth Konetschnik; Verena Maier-Kiener; Ronald Schöngrundner; Roland Brunner; Daniel Kiener; Thomas Antretter; Hans-Peter Gänser

doi:10.1109/EuroSimE.2016.7463326

Fracture and Material Behavior of Thin Film composites

Darjan Kozic, Ruth Konetschnik, Verena Maier-Kiener, Ronald Schöngrundner, Roland Brunner, Daniel Kiener, Thomas Antretter, Hans-Peter Gänser

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

4 Citations (Scopus)

Original language	English
Title of host publication	2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Publisher	Institute of Electrical and Electronics Engineers
Pages	1-6
Number of pages	6
ISBN (Electronic)	978-1-5090-2106-2/16/$31.00
DOIs	https://doi.org/10.1109/EuroSimE.2016.7463326
Publication status	Published - 2016
Event	17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Montpellier, France Duration: 17 Apr 2016 → 20 Apr 2016

Conference

Conference	17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
Country/Territory	France
City	Montpellier
Period	17/04/16 → 20/04/16

Access to Document

10.1109/EuroSimE.2016.7463326

Cite this

Kozic, D., Konetschnik, R., Maier-Kiener, V., Schöngrundner, R., Brunner, R., Kiener, D., Antretter, T., & Gänser, H.-P. (2016). Fracture and Material Behavior of Thin Film composites. In 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (pp. 1-6). Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/EuroSimE.2016.7463326

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title = "Fracture and Material Behavior of Thin Film composites",

author = "Darjan Kozic and Ruth Konetschnik and Verena Maier-Kiener and Ronald Sch{\"o}ngrundner and Roland Brunner and Daniel Kiener and Thomas Antretter and Hans-Peter G{\"a}nser",

year = "2016",

doi = "10.1109/EuroSimE.2016.7463326",

language = "English",

pages = "1--6",

booktitle = "2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)",

publisher = "Institute of Electrical and Electronics Engineers",

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note = "17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems ; Conference date: 17-04-2016 Through 20-04-2016",

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Kozic, D, Konetschnik, R, Maier-Kiener, V, Schöngrundner, R, Brunner, R, Kiener, D , Antretter, T & Gänser, H-P 2016, Fracture and Material Behavior of Thin Film composites. in 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) . Institute of Electrical and Electronics Engineers, pp. 1-6, 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Montpellier, France, 17/04/16. https://doi.org/10.1109/EuroSimE.2016.7463326

Fracture and Material Behavior of Thin Film composites. / Kozic, Darjan; Konetschnik, Ruth; Maier-Kiener, Verena et al.
2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) . Institute of Electrical and Electronics Engineers, 2016. p. 1-6.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Fracture and Material Behavior of Thin Film composites

AU - Kozic, Darjan

AU - Konetschnik, Ruth

AU - Maier-Kiener, Verena

AU - Schöngrundner, Ronald

AU - Brunner, Roland

AU - Kiener, Daniel

AU - Antretter, Thomas

AU - Gänser, Hans-Peter

PY - 2016

Y1 - 2016

U2 - 10.1109/EuroSimE.2016.7463326

DO - 10.1109/EuroSimE.2016.7463326

M3 - Conference contribution

SP - 1

EP - 6

BT - 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

PB - Institute of Electrical and Electronics Engineers

T2 - 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

Y2 - 17 April 2016 through 20 April 2016

ER -

Kozic D, Konetschnik R, Maier-Kiener V, Schöngrundner R, Brunner R, Kiener D et al. Fracture and Material Behavior of Thin Film composites. In 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) . Institute of Electrical and Electronics Engineers. 2016. p. 1-6 doi: 10.1109/EuroSimE.2016.7463326