High resolution residual stress gradient characterization in W/TiN-stack on Si(100): Correlating in-plane stress and grain size distributions in W sublayer

René Hammer, Juraj Todt, Jozef Keckes, Bernhard Sartory, Georg Parteder, Jochen Kraft, Stefan Defregger

Research output: Contribution to journalArticleResearchpeer-review

7 Citations (Scopus)
Original languageEnglish
Pages (from-to)72-78
Number of pages7
JournalMaterials and Design
Issue number15 October
Early online date23 Jun 2017
Publication statusPublished - 15 Oct 2017


  • Grain size distribution
  • Hall-Petch
  • Ion beam layer removal
  • Nanocrystalline
  • Residual stress profile
  • Tungsten thin film

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