Improved nanoindentation methods for polymer based multilayer film cross-sections

P. Christoefl; J. E. Jakes; J. Geier; G. Pinter; G. Oreski; D. Stone; C. Teichert

doi:10.1109/EuroSimE56861.2023.10100815

Improved nanoindentation methods for polymer based multilayer film cross-sections

P. Christoefl, J. E. Jakes, J. Geier, G. Pinter, G. Oreski, D. Stone, C. Teichert

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Original language	English
Title of host publication	2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023
Publisher	Institute of Electrical and Electronics Engineers
ISBN (Electronic)	9798350345971
DOIs	https://doi.org/10.1109/EuroSimE56861.2023.10100815
Publication status	Published - 2023
Event	24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023 - Graz, Austria Duration: 16 Apr 2023 → 19 Apr 2023

Publication series

Name	2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023

Conference

Conference	24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023
Country/Territory	Austria
City	Graz
Period	16/04/23 → 19/04/23

Bibliographical note

Publisher Copyright:
© 2023 IEEE.

Access to Document

10.1109/EuroSimE56861.2023.10100815

Cite this

Christoefl, P., Jakes, J. E., Geier, J., Pinter, G., Oreski, G., Stone, D., & Teichert, C. (2023). Improved nanoindentation methods for polymer based multilayer film cross-sections. In 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023 (2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023). Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/EuroSimE56861.2023.10100815

Christoefl, P. ; Jakes, J. E. ; Geier, J. et al. / Improved nanoindentation methods for polymer based multilayer film cross-sections. 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023. Institute of Electrical and Electronics Engineers, 2023. (2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023).

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Christoefl, P, Jakes, JE, Geier, J, Pinter, G , Oreski, G, Stone, D & Teichert, C 2023, Improved nanoindentation methods for polymer based multilayer film cross-sections. in 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023. 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023, Institute of Electrical and Electronics Engineers, 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023, Graz, Austria, 16/04/23. https://doi.org/10.1109/EuroSimE56861.2023.10100815

Improved nanoindentation methods for polymer based multilayer film cross-sections. / Christoefl, P.; Jakes, J. E.; Geier, J. et al.
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023. Institute of Electrical and Electronics Engineers, 2023. (2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Improved nanoindentation methods for polymer based multilayer film cross-sections

AU - Christoefl, P.

AU - Jakes, J. E.

AU - Geier, J.

AU - Pinter, G.

AU - Oreski, G.

AU - Stone, D.

AU - Teichert, C.

PY - 2023

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U2 - 10.1109/EuroSimE56861.2023.10100815

DO - 10.1109/EuroSimE56861.2023.10100815

M3 - Conference contribution

AN - SCOPUS:85158145947

T3 - 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023

BT - 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023

PB - Institute of Electrical and Electronics Engineers

T2 - 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023

Y2 - 16 April 2023 through 19 April 2023

ER -

Christoefl P, Jakes JE, Geier J, Pinter G , Oreski G, Stone D et al. Improved nanoindentation methods for polymer based multilayer film cross-sections. In 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023. Institute of Electrical and Electronics Engineers. 2023. (2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023). doi: 10.1109/EuroSimE56861.2023.10100815

Improved nanoindentation methods for polymer based multilayer film cross-sections

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