Influence of environmental factors like temperature and humidity on MEMS packaging materials.

Mahesh Yalagach; Peter Filipp Fuchs; Ivaylo Mitev; Thomas Antretter; Michael Feuchter; Archim Wolfberger; Tao Qi

doi:10.1109/ESTC.2018.8546484

Influence of environmental factors like temperature and humidity on MEMS packaging materials.

Mahesh Yalagach, Peter Filipp Fuchs, Ivaylo Mitev, Thomas Antretter, Michael Feuchter, Archim Wolfberger, Tao Qi

Montanuniversität

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

3 Citations (Scopus)

Original language	English
Title of host publication	2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings
Publisher	Institute of Electrical and Electronics Engineers
ISBN (Electronic)	9781538668139
DOIs	https://doi.org/10.1109/ESTC.2018.8546484
Publication status	Published - 26 Nov 2018
Event	7th Electronic System-Integration Technology Conference, ESTC 2018 - Dresden, Germany Duration: 18 Sept 2018 → 21 Sept 2018

Conference

Conference	7th Electronic System-Integration Technology Conference, ESTC 2018
Country/Territory	Germany
City	Dresden
Period	18/09/18 → 21/09/18

Keywords

hygro-thermo-mechanical simulation
hygroscopic swelling
moisture diffusion
Thermo-mechanical characterization

Access to Document

10.1109/ESTC.2018.8546484

Cite this

Yalagach, M., Fuchs, P. F., Mitev, I., Antretter, T., Feuchter, M., Wolfberger, A., & Qi, T. (2018). Influence of environmental factors like temperature and humidity on MEMS packaging materials. In 2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings Article 8546484 Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/ESTC.2018.8546484

@inproceedings{d294c95c9bb24fe7abd29bc38b5747a2,

title = "Influence of environmental factors like temperature and humidity on MEMS packaging materials.",

keywords = "hygro-thermo-mechanical simulation, hygroscopic swelling, moisture diffusion, Thermo-mechanical characterization",

author = "Mahesh Yalagach and Fuchs, {Peter Filipp} and Ivaylo Mitev and Thomas Antretter and Michael Feuchter and Archim Wolfberger and Tao Qi",

year = "2018",

month = nov,

day = "26",

doi = "10.1109/ESTC.2018.8546484",

language = "English",

booktitle = "2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings",

publisher = "Institute of Electrical and Electronics Engineers",

address = "United States",

note = "7th Electronic System-Integration Technology Conference, ESTC 2018 ; Conference date: 18-09-2018 Through 21-09-2018",

}

Yalagach, M, Fuchs, PF, Mitev, I, Antretter, T , Feuchter, M, Wolfberger, A & Qi, T 2018, Influence of environmental factors like temperature and humidity on MEMS packaging materials. in 2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings., 8546484, Institute of Electrical and Electronics Engineers, 7th Electronic System-Integration Technology Conference, ESTC 2018, Dresden, Germany, 18/09/18. https://doi.org/10.1109/ESTC.2018.8546484

Influence of environmental factors like temperature and humidity on MEMS packaging materials. / Yalagach, Mahesh; Fuchs, Peter Filipp; Mitev, Ivaylo et al.
2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings. Institute of Electrical and Electronics Engineers, 2018. 8546484.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Influence of environmental factors like temperature and humidity on MEMS packaging materials.

AU - Yalagach, Mahesh

AU - Fuchs, Peter Filipp

AU - Mitev, Ivaylo

AU - Antretter, Thomas

AU - Feuchter, Michael

AU - Wolfberger, Archim

AU - Qi, Tao

PY - 2018/11/26

Y1 - 2018/11/26

KW - hygro-thermo-mechanical simulation

KW - hygroscopic swelling

KW - moisture diffusion

KW - Thermo-mechanical characterization

UR - http://www.scopus.com/inward/record.url?scp=85060016126&partnerID=8YFLogxK

U2 - 10.1109/ESTC.2018.8546484

DO - 10.1109/ESTC.2018.8546484

M3 - Conference contribution

AN - SCOPUS:85060016126

BT - 2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings

PB - Institute of Electrical and Electronics Engineers

T2 - 7th Electronic System-Integration Technology Conference, ESTC 2018

Y2 - 18 September 2018 through 21 September 2018

ER -

Influence of environmental factors like temperature and humidity on MEMS packaging materials.

Conference

Keywords

Access to Document

Other files and links

Cite this