Integrated experimental and computational approach for residual stress investigation near through-silicon vias

Marco Deluca, R. Hammer, Jozef Keckes, J. Kraft, F. Schrank, Juraj Todt, O. Robach, J. S. Micha, Stefan Defregger

Research output: Contribution to journalArticleResearchpeer-review

5 Citations (Scopus)

Cite this