Investigation of high cyclic fatigue behaviour of thin copper films using MEMS structure

F. Saghaeian, M. Lederer, A. Hofer, J. Todt, J. Keckes, G. Khatibi

Research output: Contribution to journalArticleResearchpeer-review

6 Citations (Scopus)
Original languageEnglish
Article number105179
Number of pages8
JournalInternational Journal of Fatigue
Volume128.2019
Issue numberNovember
Early online date28 Jun 2019
DOIs
Publication statusPublished - 19 Jul 2019

Keywords

  • Electronic material
  • High cycle fatigue
  • MEMS
  • Microstructures
  • Reliability

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