Low cycle fatigue of Cu thin films: Novel approaches for thermomechanical testing & microstructural analysis

Stephan Bigl, Stefan Wurster, Megan J Cordill, Daniel Kiener

Research output: Contribution to conferencePresentationResearch

Original languageEnglish
Publication statusPublished - 22 Mar 2016
Event27th Colloquium on Fatigue Mechanisms - University of Vienna, Wien, Austria
Duration: 22 Mar 201622 Mar 2016

Conference

Conference27th Colloquium on Fatigue Mechanisms
Country/TerritoryAustria
CityWien
Period22/03/1622/03/16

Cite this