Low cycle fatigue of Cu thin films: Novel approaches for thermomechanical testing & microstructural analysis

Research output: Contribution to conference › Presentation › Research

Original language	English
Publication status	Published - 22 Mar 2016
Event	27th Colloquium on Fatigue Mechanisms - University of Vienna, Wien, Austria Duration: 22 Mar 2016 → 22 Mar 2016

Conference	27th Colloquium on Fatigue Mechanisms
Country/Territory	Austria
City	Wien
Period	22/03/16 → 22/03/16

Cite this

@conference{05f486002ea34d70b5925aa591c31681,

title = "Low cycle fatigue of Cu thin films: Novel approaches for thermomechanical testing \& microstructural analysis",

author = "Stephan Bigl and Stefan Wurster and Cordill, \{Megan J\} and Daniel Kiener",

year = "2016",

month = mar,

day = "22",

language = "English",

note = "27th Colloquium on Fatigue Mechanisms ; Conference date: 22-03-2016 Through 22-03-2016",

}