Microstructure and adhesion of as-deposited and annealed Cu/Ti films on polyimide

Megan Cordill, Aidan Taylor, J. Schalko, Gerhard Dehm

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17 Citations (Scopus)

Translated title of the contribution	Microstructure and adhesion of as-deposited and annealed Cu/Ti films on polyimide
Original language	English
Pages (from-to)	729-734
Journal	International journal of materials research : IJMR ; Zeitschrift für Metallkunde
Publication status	Published - 2011

Cite this

@article{77836a4f088144fdad5de6aba2ec21ec,

title = "Microstructure and adhesion of as-deposited and annealed Cu/Ti films on polyimide",

author = "Megan Cordill and Aidan Taylor and J. Schalko and Gerhard Dehm",

year = "2011",

language = "English",

pages = "729--734",

journal = "International journal of materials research : IJMR ; Zeitschrift f{\"u}r Metallkunde",

issn = "1862-5282",

publisher = "Carl Hanser Verlag GmbH & Co. KG",

}

TY - JOUR

T1 - Microstructure and adhesion of as-deposited and annealed Cu/Ti films on polyimide

AU - Cordill, Megan

AU - Taylor, Aidan

AU - Schalko, J.

AU - Dehm, Gerhard

PY - 2011

Y1 - 2011

M3 - Article

SN - 1862-5282

SP - 729

EP - 734

JO - International journal of materials research : IJMR ; Zeitschrift für Metallkunde

JF - International journal of materials research : IJMR ; Zeitschrift für Metallkunde

ER -