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Microstructure and stress gradients in TiW thin films characterized by 40 nm X-ray diffraction and transmission electron microscopy

  • Fahimeh Saghaeian
  • , Jozef Keckes
  • , Stefan Woehlert
  • , M. Rosenthal
  • , M. Reisinger
  • , J. Todt
  • Infineon Technologies AG Austria
  • ESRF
  • KAI - Kompetenzzentrum Automobil- und Industrieelektronik GmbH
  • Erich Schmid Institute of Materials Science

Research output: Contribution to journalArticleResearchpeer-review

3 Citations (Scopus)
Original languageEnglish
Article number137576
Number of pages7
JournalThin solid films
Volume691.2019
Issue number1 December
DOIs
Publication statusE-pub ahead of print - 14 Oct 2019

Keywords

  • Internal stress
  • Residual stress
  • Thin film
  • Titanium tungsten, Diffusion barrier
  • X-ray nanodiffraction

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