@inproceedings{3ede049b8c6847dc9ca99f09b7c35cd6,
title = "Multi-physics simulation of the component attachment within embedding process",
keywords = "adhesives, circuit complexity, formal verification, printed circuits, PCB complexity, adhesive thickness, commercial program Ansys FLUENT, component attachment, embedding process, model validation, multiphysics simulation, numerical model, printed circuit boards complexity, Abstracts, Analytical models, Copper, Differential equations, Numerical models, Reliability",
author = "Katerina Macurova and A. Kharicha and M. Pletz and M. Mataln and Raul Bermejo and R. Schongrundner and T. Krivec and T. Antretter and W. Maia and M. Morianz and M. Brizoux",
year = "2013",
month = apr,
day = "1",
doi = "10.1109/EuroSimE.2013.6529914",
language = "English",
isbn = "978-1-4673-6138-5",
pages = "1--6",
booktitle = "14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013",
publisher = "Institute of Electrical and Electronics Engineers",
address = "United States",
note = "EuroSimE 2013 ; Conference date: 15-04-2013 Through 17-04-2013",
}