Multimethod cross-sectional characterization approaching the limits of diamond monophase multilayers

Michael Meindlhumer, Jakob Grau, Hadwig Sternschulte, Yuriy Halahovets, Peter Siffalovic, Manfred Burghammer, Doris Steinmüller-Nethl, Jozef Keckes

Research output: Contribution to journalArticleResearchpeer-review

Abstract

Chemical vapour deposited diamond draws significant scientific interest due to its wide range of mechanical and functional properties, which can be easily tuned by the applied deposition conditions. Here, hot filament chemical vapour deposition was used to synthesize four monophase multilayer diamond thin films with individual layer thickness down to ∼ 300 nm. Extensive structural characterization by scanning electron microscopy and Raman spectroscopy on the cross-section confirmed the different diamond morphologies originating from the different applied process parameters of the individual sublayers, where Raman spectroscopy could give a clear distinction between nano- and microcrystalline diamond down to a layer thickness of ∼ 1 μm. Cross-sectional X-ray nanodiffraction identified exclusively the diamond crystal structure throughout the cross-section of the multilayered diamond thin films. Cross-sectional phase and FWHM analysis allowed to discriminate between the diamond morphologies down to ∼ 500 nm, thus identifying the limitations of monophase diamond multilayers. While the microcrystalline diamond sublayers all exhibit pronounced structural gradients expressed in (i) increasing intensity of the 111 Debye-Scherrer ring, (ii) ⟨110⟩ fibre texture, and periodic variations of (iii) grain size and (iv) residual stress, the nanocrystalline diamond sublayers showed no pronounced cross-sectional variations. In summary, the experimental results provide insights into the cross-sectional evolution of microstructure and residual stress and the limitations of monophase multilayered diamond thin films.
Original languageEnglish
Article number113973
Number of pages15
JournalMaterials characterization
Volume212.2024
Issue numberJune
DOIs
Publication statusPublished - 13 May 2024

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