Novel temperature dependent tensile test of freestanding copper thin film structures

Translated title of the contribution: Novel temperature dependent tensile test of freestanding copper thin film structures

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Translated title of the contribution	Novel temperature dependent tensile test of freestanding copper thin film structures
Original language	German
Pages (from-to)	064702/1-064702/9
Journal	Review of scientific instruments
Volume	Jun;(6)
DOIs	https://doi.org/10.1063/1.4725529
Publication status	Published - 2012

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@article{8bb18c3fff11431db157ca16b62ed013,

title = "Novel temperature dependent tensile test of freestanding copper thin film structures",

author = "M. Smolka and Christian Motz and T. Detzel and W. Robl and Thomas Grie{\ss}er and Wimmer, \{Alexander Christoph\} and Gerhard Dehm",

year = "2012",

doi = "10.1063/1.4725529",

language = "Deutsch",

volume = "Jun;(6)",

pages = "064702/1--064702/9",

journal = "Review of scientific instruments",

issn = "0034-6748",

publisher = "American Institute of Physics",

}

TY - JOUR

T1 - Novel temperature dependent tensile test of freestanding copper thin film structures

AU - Smolka, M.

AU - Motz, Christian

AU - Detzel, T.

AU - Robl, W.

AU - Grießer, Thomas

AU - Wimmer, Alexander Christoph

AU - Dehm, Gerhard

PY - 2012

Y1 - 2012

U2 - 10.1063/1.4725529

DO - 10.1063/1.4725529

M3 - Artikel

SN - 0034-6748

VL - Jun;(6)

SP - 064702/1-064702/9

JO - Review of scientific instruments

JF - Review of scientific instruments

ER -