@inproceedings{ffdd320cd7ba489fa2c0d183e30d564e,
title = "Numerical analysis of a MEMS sensor's deformation behavior considering dynamic moisture conditions",
keywords = "advanced hygro-thermo-mechanical simulation, die deformation, four-point bending, Moisture diffusion, pressure sensor",
author = "Mahesh Yalagach and Fuchs, {Peter Filipp} and Thomas Antretter and Tao Qi and Markus Weber",
note = "Publisher Copyright: {\textcopyright} 2020 IEEE.; 22nd IEEE Electronics Packaging Technology Conference, EPTC 2020 ; Conference date: 02-12-2020 Through 04-12-2020",
year = "2020",
month = dec,
day = "2",
doi = "10.1109/EPTC50525.2020.9315091",
language = "English",
series = "2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020",
publisher = "Institute of Electrical and Electronics Engineers",
pages = "380--385",
booktitle = "2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020",
address = "United States",
}