Numerical analysis of the influence of polymeric materials on a MEMS package performance under humidity and temperature loads

Mahesh Yalagach; Peter Filipp Fuchs; Archim Wolfberger; Mario Gschwandl; Thomas Antretter; Michael Feuchter; Coen Tak; Qi Tao

doi:10.1109/ECTC.2019.00311

Numerical analysis of the influence of polymeric materials on a MEMS package performance under humidity and temperature loads

Mahesh Yalagach, Peter Filipp Fuchs, Archim Wolfberger, Mario Gschwandl, Thomas Antretter, Michael Feuchter, Coen Tak, Qi Tao

Montanuniversität

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Original language	English
Title of host publication	Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019
Publisher	Institute of Electrical and Electronics Engineers
Pages	2029-2035
Number of pages	7
ISBN (Electronic)	9781728114989
ISBN (Print)	9781728114989
DOIs	https://doi.org/10.1109/ECTC.2019.00311
Publication status	Published - 1 May 2019
Event	69th IEEE Electronic Components and Technology Conference, ECTC 2019 - Las Vegas, United States Duration: 28 May 2019 → 31 May 2019

Publication series

Name	2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)
ISSN (Print)	0569-5503

Conference

Conference	69th IEEE Electronic Components and Technology Conference, ECTC 2019
Country/Territory	United States
City	Las Vegas
Period	28/05/19 → 31/05/19

Keywords

deformation
hygro-mechanical characterization
hygro-thermal
hygro-thermo-mechanical simulation
hygroscopic swelling
solubility

Access to Document

10.1109/ECTC.2019.00311

Cite this

Yalagach, M., Filipp Fuchs, P., Wolfberger, A., Gschwandl, M., Antretter, T., Feuchter, M., Tak, C., & Tao, Q. (2019). Numerical analysis of the influence of polymeric materials on a MEMS package performance under humidity and temperature loads. In Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019 (pp. 2029-2035). Article 8811123 (2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)). Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/ECTC.2019.00311

Yalagach, Mahesh ; Filipp Fuchs, Peter ; Wolfberger, Archim et al. / Numerical analysis of the influence of polymeric materials on a MEMS package performance under humidity and temperature loads. Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019. Institute of Electrical and Electronics Engineers, 2019. pp. 2029-2035 (2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)).

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title = "Numerical analysis of the influence of polymeric materials on a MEMS package performance under humidity and temperature loads",

keywords = "deformation, hygro-mechanical characterization, hygro-thermal, hygro-thermo-mechanical simulation, hygroscopic swelling, solubility",

author = "Mahesh Yalagach and {Filipp Fuchs}, Peter and Archim Wolfberger and Mario Gschwandl and Thomas Antretter and Michael Feuchter and Coen Tak and Qi Tao",

year = "2019",

month = may,

day = "1",

doi = "10.1109/ECTC.2019.00311",

language = "English",

isbn = "9781728114989",

series = "2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)",

publisher = "Institute of Electrical and Electronics Engineers",

pages = "2029--2035",

booktitle = "Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019",

address = "United States",

note = "69th IEEE Electronic Components and Technology Conference, ECTC 2019 ; Conference date: 28-05-2019 Through 31-05-2019",

}

Yalagach, M, Filipp Fuchs, P, Wolfberger, A, Gschwandl, M, Antretter, T , Feuchter, M, Tak, C & Tao, Q 2019, Numerical analysis of the influence of polymeric materials on a MEMS package performance under humidity and temperature loads. in Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019., 8811123, 2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), Institute of Electrical and Electronics Engineers, pp. 2029-2035, 69th IEEE Electronic Components and Technology Conference, ECTC 2019, Las Vegas, United States, 28/05/19. https://doi.org/10.1109/ECTC.2019.00311

Numerical analysis of the influence of polymeric materials on a MEMS package performance under humidity and temperature loads. / Yalagach, Mahesh; Filipp Fuchs, Peter; Wolfberger, Archim et al.
Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019. Institute of Electrical and Electronics Engineers, 2019. p. 2029-2035 8811123 (2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Numerical analysis of the influence of polymeric materials on a MEMS package performance under humidity and temperature loads

AU - Yalagach, Mahesh

AU - Filipp Fuchs, Peter

AU - Wolfberger, Archim

AU - Gschwandl, Mario

AU - Antretter, Thomas

AU - Feuchter, Michael

AU - Tak, Coen

AU - Tao, Qi

PY - 2019/5/1

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KW - deformation

KW - hygro-mechanical characterization

KW - hygro-thermal

KW - hygro-thermo-mechanical simulation

KW - hygroscopic swelling

KW - solubility

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DO - 10.1109/ECTC.2019.00311

M3 - Conference contribution

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SN - 9781728114989

T3 - 2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)

SP - 2029

EP - 2035

BT - Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019

PB - Institute of Electrical and Electronics Engineers

T2 - 69th IEEE Electronic Components and Technology Conference, ECTC 2019

Y2 - 28 May 2019 through 31 May 2019

ER -

Yalagach M, Filipp Fuchs P, Wolfberger A, Gschwandl M, Antretter T , Feuchter M et al. Numerical analysis of the influence of polymeric materials on a MEMS package performance under humidity and temperature loads. In Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019. Institute of Electrical and Electronics Engineers. 2019. p. 2029-2035. 8811123. (2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)). doi: 10.1109/ECTC.2019.00311

Numerical analysis of the influence of polymeric materials on a MEMS package performance under humidity and temperature loads

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