Numerical simulation of the electrical performance of printed circuit boards under cyclic thermal loads

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5 Citations (Scopus)

Original language	English
Pages (from-to)	148-155
Journal	Microelectronics Reliability
Publication status	Published - 2016

Cite this

@article{8ae450ab7d3f424ba86b0a7bb25785ba,

title = "Numerical simulation of the electrical performance of printed circuit boards under cyclic thermal loads",

author = "Klaus Fellner and Thomas Antretter and Fuchs, \{Peter Filipp\} and Qi Tao",

year = "2016",

language = "English",

pages = "148--155",

journal = "Microelectronics Reliability",

issn = "0026-2714",

publisher = "Elsevier Ltd",

}