Numerical Simulation of Thermomechanical Material Behavior and Damage in Lead-Free Solders

This cumulative dissertation presents a collection of five papers that contribute to the field of Numerical Simulation of Thermomechanical Material Behavior and Damage in Lead-Free Solders. The research focuses on developing a comprehensive modeling framework for SAC305, a widely used lead-free solder alloy, by integrating thermo-kinetic models for intermetallic compound formation and vacancy diffusion with continuum mechanical constitutive laws. The aim is to gain a better understanding of the complex interactions between diffusion, phase formation, and mechanical property changes that govern the behavior of SAC305 solder joints. The papers presented in this dissertation address various aspects of this challenge, including the formulation of a reactive diffusion model, its coupling with continuum mechanics, and the simulation of damage evolution under thermo-mechanical loading. The results of this research provide new insights into the thermomechanical behavior of SAC305 solder joints and contribute to the ongoing efforts to improve the reliability and performance of electronic devices.