Translated title of the contribution | PCB drop test lifetime assessment based on simulations and cyclic bend tests |
---|---|
Original language | English |
Pages (from-to) | 774-781 |
Journal | Microelectronics Reliability |
Volume | 53 |
Publication status | Published - 2013 |
PCB drop test lifetime assessment based on simulations and cyclic bend tests
Peter Fuchs, Gerald Pinter, Zoltan Major
Research output: Contribution to journal › Article › Research › peer-review
11
Citations
(Scopus)